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AD7264BSTZ Fiches technique(PDF) 28 Page - Analog Devices |
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AD7264BSTZ Fiches technique(HTML) 28 Page - Analog Devices |
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28 / 32 page ![]() AD7264 Rev. A | Page 28 of 32 OUTLINE DIMENSIONS PIN 1 INDICATOR TOP VIEW 6.75 BSC SQ 7.00 BSC SQ 1 48 12 13 37 36 24 25 5.25 5.10 SQ 4.95 0.50 0.40 0.30 0.30 0.23 0.18 0.50 BSC 12° MAX 0.20 REF 0.80 MAX 0.65 TYP 1.00 0.85 0.80 5.50 REF 0.05 MAX 0.02 NOM 0.60 MAX 0.60 MAX PIN 1 INDICATOR COPLANARITY 0.08 SEATING PLANE 0.25 MIN EXPOSED PAD (BOTTOM VIEW) COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2 THE EXPOSED METAL PADDLE ON THE BOTTOM OF THE LFCSP PACKAGE MUST BE SOLDERED TO PCB GROUND FOR PROPER HEAT DISSIPATION AND ALSO FOR NOISE AND MECHANICAL STRENGTH BENEFITS. Figure 37. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7 mm × 7 mm Body, Very Thin Quad (CP-48-1) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MS-026-BBC TOP VIEW (PINS DOWN) 1 12 13 25 24 36 37 48 0.27 0.22 0.17 0.50 BSC LEAD PITCH 1.60 MAX 0.75 0.60 0.45 VIEW A PIN 1 0.20 0.09 1.45 1.40 1.35 0.08 COPLANARITY VIEW A ROTATED 90° CCW SEATING PLANE 7° 3.5° 0° 0.15 0.05 9.20 9.00 SQ 8.80 7.20 7.00 SQ 6.80 Figure 38. 48-Lead Low Profile Quad Flat Package [LQFP] (ST-48) Dimensions shown in millimeters |
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