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FXLS8961AF Fiches technique(PDF) 90 Page - NXP Semiconductors |
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FXLS8961AF Fiches technique(HTML) 90 Page - NXP Semiconductors |
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90 / 101 page ![]() NXP Semiconductors FXLS8961AF 3-Axis Low-g Accelerometer Figure 33. PCB footprint guidelines Note: To achieve optimum sensor performance over Temperature, it is important that no solder flux residues got trapped between the PCB and the bottom of the sensor package. FXLS8961AF All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.1 — 7 March 2024 90 / 101 |
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