Matters to Be Observed When Using This Product

■ Confirm the applied pressure when using an automatically mounting process for a surface-mounted type capacitor.

Excessive pressure may result in increasing leak current, short circuit, the capacitor coming off from the board, and the

like. When automatically mounting the radial lead type capacitor, check the wear of a cutter for cutting the leads and

confirm that the angle of clinching the leads is not too acute with regards to the board. Clinching the leads at too acute

of an angle applies tensile stress to the leads, which may lead to destruction of the capacitor.

■ Follow soldering conditions (preheating, soldering temperature/time, the number of soldering, etc.) in the specification

sheet. A high peak temperature or a long heating time causes the degradation of electrical characteristics or a reduction

in the guaranteed life. Note that the specified soldering conditions indicate conditions under which the degradation of

capacitor characteristics do not occur but do not indicate conditions under which stable soldering can be performed.

Check and set conditions under which stable soldering can be performed, on a case-by-case basis. Measure the

temperature of the capacitor, using a thermocouple bonded to the top of the capacitor with an epoxy-based adhesive.

This temperature measurement must be conducted in a mass-production setup.

■ The surface-mounted type capacitor is soldered by reflow soldering only. It cannot be soldered by flow soldering or

dip soldering. Carry out reflow soldering with an atmospheric heat transfer method using infrared hot air, etc.

When carrying out two rounds of reflow processes, carry out the second reflow process after the capacitor’s

temperature settles down to a normal temperature. In the case of VPS reflow, a sharp rise in the capacitor

temperature causes a change in the characteristics and appearance of the capacitor, which may give rise to a problem

with capacitor mounting. We therefore recommend execution of VPS flow at a temperature rise rate of 3

℃/second or

lower. For more information about this matter, please contact us.

■ Reflow soldering, under the reflow conditions we recommend, might result in discoloring or swelling of the case or

crack formation on the ink mark indicating the cathode. These minor problems, however, do not affect the reliability

of the capacitor at all.

■ A 6.3-mm diameter vibration-resistant capacitor has a structure that covers the auxiliary terminals to the sides of a

seat plate. In cases where you confirm formation of a fillet on the sides of the auxiliary terminals by an image

recognition means, etc., examine soldering conditions for the formation of a sufficient fillet on the auxiliary terminals

in advance before carrying out the soldering process.

Even if the formation of a sufficient fillet on the auxiliary terminals is not confirmed, a solder junction between the

lower surface of the auxiliary terminals and the board ensures vibration-resistant performance, meaning the

reliability of the capacitor is not affected.

■ The radial lead type capacitor cannot be soldered by reflow soldering. Do not dip the capacitor body, except the leads,

in solder. Heat from the solder raises the internal pressure of the capacitor and destroys it. Solder the capacitor

according to the following soldering conditions: soldering temperature of 260

℃ ±5 ℃ and soldering time of

10 seconds ±1 second.

■ Ensure that other components do not come in contact with the capacitor during the soldering process. When a

radial lead type capacitor is set in close contact with the board, check the soldered state of the capacitor well,

because its sealing rubber has no venting structure.

■ When manually soldering the capacitor, follow the soldering conditions (soldering temperature/time) specified in the

specification sheet or adopt a soldering temperature of 350

℃ and a soldering time of 3 seconds or less.

When you need to remove a capacitor already soldered, remove it after the solder is melted sufficiently so that no

stress is applied to the terminals of the capacitor. Be careful not to let the solder iron tip touch the capacitor.

The solder iron touching the capacitor may damage the capacitor.

■ When the temperature of the capacitor becomes extremely high due to preheating, solidification of the setting resin,

etc., may cause the outer sleeve of the capacitor to shrink or crack. When treating the capacitor in a thermosetting

furnace, etc., place the capacitor in an atmosphere of 150

℃ for 2 minutes or less.

■ Do not tilt or twist the capacitor soldered to a printed board or hold the capacitor to carry the board or hit the capacitor

against something. Such actions apply a force to the internal elements through the terminals and may destroy the

product.

■ Using highly active halogenous (chlorine-based or bromic) solder flux poses a concern that residual solder flux

will have negative impact on the performance and reliability of the capacitor. Check the influence of residual solder

flux before using such solder flux.

1-Dec-23