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NRF51422-QFAC-R7 Fiches technique(PDF) 8 Page - Nordic Semiconductor |
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NRF51422-QFAC-R7 Fiches technique(HTML) 8 Page - Nordic Semiconductor |
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8 / 115 page ![]() Page 8 nRF51422 Product Specification v3.1 8.9 Serial Peripheral Interface (SPI) Master specifications ......................................................................57 8.10 I2C compatible Two Wire Interface (TWI) specifications..................................................................58 8.11 GPIO Tasks and Events (GPIOTE) specifications...................................................................................59 8.12 Analog to Digital Converter (ADC) specifications...............................................................................60 8.13 Timer (TIMER) specifications.......................................................................................................................61 8.14 Real Time Counter (RTC) ..............................................................................................................................61 8.15 Temperature sensor (TEMP) .......................................................................................................................61 8.16 Random Number Generator (RNG) specifications..............................................................................62 8.17 AES Electronic Codebook Mode Encryption (ECB)specifications..................................................62 8.18 AES CCM Mode Encryption (CCM) specifications ...............................................................................62 8.19 Accelerated Address Resolver (AAR) specifications...........................................................................62 8.20 Watchdog Timer (WDT) specifications ...................................................................................................63 8.21 Quadrature Decoder (QDEC) specifications .........................................................................................63 8.22 Non-Volatile Memory Controller (NVMC) specifications..................................................................64 8.23 General Purpose I/O (GPIO) specifications ............................................................................................65 8.24 Low Power Comparator (LPCOMP) specifications..............................................................................65 9 Mechanical specifications ..................................................................................................................... 66 9.1 QFN48 package ...............................................................................................................................................66 9.2 CDAB WLCSP package ..................................................................................................................................67 9.3 CEAA WLCSP package...................................................................................................................................68 9.4 CFAC WLCSP package...................................................................................................................................69 10 Ordering information ............................................................................................................................ 70 10.1 Chip marking....................................................................................................................................................70 10.2 Inner box label.................................................................................................................................................70 10.3 Outer box label................................................................................................................................................71 10.4 Order code ........................................................................................................................................................71 10.5 Abbreviations...................................................................................................................................................72 10.6 Code ranges and values ...............................................................................................................................73 10.7 Product options ..............................................................................................................................................75 11 Reference circuitry.................................................................................................................................. 76 11.1 PCB guidelines.................................................................................................................................................76 11.2 Reference design schematics.....................................................................................................................78 11.3 QFAA QFN48 package ..................................................................................................................................79 11.4 QFAB QFN48 package...................................................................................................................................85 11.5 QFAC QFN48 package...................................................................................................................................91 11.6 CDAB WLCSP package ..................................................................................................................................97 11.7 CEAA WLCSP package................................................................................................................................ 103 11.8 CFAC WLCSP package................................................................................................................................ 109 12 Glossary ..................................................................................................................................................115 |
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