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653 Fiches technique(PDF) 2 Page - Nexperia B.V. All rights reserved |
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653 Fiches technique(HTML) 2 Page - Nexperia B.V. All rights reserved |
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2 / 15 page ![]() 74HC_HCT00 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 — 25 November 2015 2 of 15 NXP Semiconductors 74HC00; 74HCT00 Quad 2-input NAND gate 4. Functional diagram 5. Pinning information 5.1 Pinning Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one gate) (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SO14 and (T)SSOP14 Fig 5. Pin configuration DHVQFN14 |
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