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AD8231TCPZ-EP-R7 Fiches technique(PDF) 18 Page - Analog Devices |
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AD8231TCPZ-EP-R7 Fiches technique(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() AD8231-EP Data Sheet Rev. A | Page 18 of 20 OUTLINE DIMENSIONS 2.70 2.60 SQ 2.50 COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 1 0.65 BSC 16 5 8 9 12 13 4 4.10 4.00 SQ 3.90 0.45 0.40 0.35 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 0.35 0.30 0.25 BOTTOM VIEW SEATING PLANE TOP VIEW SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 1 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) DETAIL A (JEDEC 95) EXPOSED PAD Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-16-17) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD8231TCPZ-EP-R7 −55°C to +125°C 16-Lead LFCSP, 7”Tape and Reel CP-16-17 1 Z = RoHS Compliant Part. |
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