TDA7418 datasheet(27/29 Pages) STMICROELECTRONICS

27 / 29 page

TDA7418

Package information

27/29

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 19.

SO20 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

2.35

2.65

0.093

0.104

0.10

0.30

0.004

0.012

0.33

0.51

0.013

0.200

0.23

0.32

0.009

0.013

D (1)

12.60

13.00

0.496

0.512

7.40

7.60

0.291

0.299

1.27

0.050

10.0

10.65

0.394

0.419

0.25

0.75

0.010

0.030

0.40

1.27

0.016

0.050

0˚ (min.), 8˚ (max.)

ddd

0.10

0.004

(1) “D” dimension does not include mold flash, protusions or gate

burrs. Mold flash, protusions or gate burrs shall not exceed

0.15mm per side.

SO20

0016022 D

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