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LE-B-Q8WP-AM Fiches technique(PDF) 13 Page - ams-OSRAM AG |
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LE-B-Q8WP-AM Fiches technique(HTML) 13 Page - ams-OSRAM AG |
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13 / 22 page ![]() LE B Q8WP Automotive DATASHEET DATASHEET 13 | Version 1.2 | 2025-06-23 Recommended Solder Pad 8) Recommended Solder Pad 8) Alternative solder pad for exposed copper MCPCB - do not use exposed copper MCPCB for automotive applications. Exposed Copper MCPCB must not exceed thickness of 1mm. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. |
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