TSV321-TSV358-TSV324

Package information

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3

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

3.1

SOT23-5 package information

Figure 19.

SOT23-5 package mechanical drawing

Table 5.

SOT23-5 package mechanical data

Ref.

Dimensions

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.90

1.45

35.4

57.1

A1

0.00

0.15

0.00

5.9

A2

0.90

1.30

35.4

51.2

b

0.35

0.50

13.7

19.7

C

0.09

0.20

3.5

7.8

D

2.80

3.00

110.2

118.1

E

2.60

3.00

102.3

118.1

E1

1.50

1.75

59.0

68.8

e

0.95

37.4

e1

1.9

74.8

L

0.35

0.55

13.7

21.6