DA7282-00FVC datasheet(14/75 Pages) RENESAS

No de pièce	DA7282-00FVC

Description	LRA/ERM Ultra-Low Power Haptic Driver with Multiple Input Triggers and Integrated Waveform Memory

PDF	75 Pages

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Fabricant	RENESAS [Renesas Technology Corp]

Site Internet	http://www.renesas.com

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LRA/ERM Ultra-Low Power Haptic Driver with Multiple Input Triggers and Integrated Waveform Memory

R15DS0041EE0330 Rev.3.30

June 16, 2026

CFR0011-120-00

Page 14

5.5

Thermal Specifications

Table 10. WLCSP thermal ratings

Parameter

Description (Note 1)

Min

Typ

Max

Unit

RƟJA

Junction-to-ambient thermal resistance

90.3

°C/W

RƟJC_TOP

Junction-to-case (top) thermal resistance

43.6

°C/W

RƟJB

Junction-to-board thermal resistance

49.0

°C/W

JT

Junction-to-top characterization parameter

6.4

°C/W

JB

Junction-to-board characterization parameter

45.8

°C/W

Note 1

Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.

Table 11. QFN thermal ratings

Parameter

Description (Note 1)

Min

Typ

Max

Unit

RƟJA

Junction-to-ambient thermal resistance

88.2

°C/W

RƟJC_TOP

Junction-to-case (top) thermal resistance

54.6

°C/W

RƟJB

Junction-to-board thermal resistance

39.3

°C/W

JT

Junction-to-top characterization parameter

3.4

°C/W

JB

Junction-to-board characterization parameter

50.0

°C/W

RƟJC_BOTTOM

Junction-to-case (bottom) thermal resistance

4.4

°C/W

Note 1

Multilayer JEDEC standard, still air, ambient temperature 25 °C, simulated value.

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