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TAS2781RYYR Fiches technique(PDF) 87 Page - Texas Instruments |
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TAS2781RYYR Fiches technique(HTML) 87 Page - Texas Instruments |
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87 / 90 page ![]() www.ti.com PACKAGE OUTLINE 3.6 3.4 4.1 3.9 1.0 0.8 0.05 0.00 2X 2.4 22X 0.4 2X 2 19X 0.5 0.3 26X 0.25 0.15 1.28 8X 0.425 0.95 2X 0.9 0.7 0.55 0.35 0.6 0.4 0.825 0.625 2X 0.9 0.7 8X 0.3 0.2 (0.09) TYP VQFN-HR - 1 mm max height RYY0030A PLASTIC QUAD FLATPACK - NO LEAD 4228222/B 05/2022 0.08 C 0.1 C A B 0.05 C 0.1 C A B 0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID (45 X 0.15) SYMM SYMM 1 8 9 16 17 23 24 30 SCALE 3.000 A B C |
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