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ISOTMP35RDFPR Fiches technique(PDF) 41 Page - Texas Instruments |
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ISOTMP35RDFPR Fiches technique(HTML) 41 Page - Texas Instruments |
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41 / 44 page ![]() www.ti.com PACKAGE OUTLINE C 10X 0.5 2X 2.5 12X 0.32 0.12 SEATING PLANE 0.25 GAGE PLANE 0 -8 15 TYP 0.25 0.13 TYP 10.63 9.97 TYP 2.65 MAX 0.20 0.05 B 7.6 7.4 NOTE 4 A 3.8 3.5 NOTE 3 1.27 0.40 SSOP - 2.65 mm max height DFP0012A SMALL OUTLINE PACKAGE 4230284/B 02/2025 1 6 7 12 0.1 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. A 15 DETAIL A TYPICAL SCALE 1.800 |
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