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STM32F103X8 Fiches technique(PDF) 67 Page - STMicroelectronics |
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STM32F103X8 Fiches technique(HTML) 67 Page - STMicroelectronics |
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67 / 84 page ![]() STM32F103xx Electrical characteristics 67/84 Figure 30. Typical connection diagram using the ADC 1. Refer to Table 44 for the values of CAIN, RAIN, RADC and CADC. 2. CPARASITIC must be added to CAIN. It represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (3 pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC should be reduced. General PCB design guidelines Power supply decoupling should be performed as shown in Figure 31 or Figure 32, depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be ceramic (good quality). They should be placed them as close as possible to the chip. Figure 31. Power supply and reference decoupling (VREF+ not connected to VDDA) 1. VREF+ and VREF– inputs are available only on 100-pin packages. ai14150b STM32F103xx VDD AINx IL±1 µA 0.6 V VT RAIN(1) CAIN VAIN 0.6 V VT RADC(1) 12-bit A/D conversion CADC(1) VREF+ (see note 1) STM32F103xx VDDA VSSA /VREF– (see note 1) 1 µF // 10 nF 1 µF // 10 nF ai14388b |
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