This information applies to a product under development. Its characteristics and specifications are subject to change without notice.

Analog Devices assumes no obligation regarding future manufacture unless otherwise agreed to in writing.

OP150/OP250/OP450

REV. 0

PRELIMINARY TECHNICAL DATA

–5–

DICE CHARACTERISTICS

OP150 Die Size 0.00

× 0.00 Inch, 00 Sq. Mils

Substrate (Die Backside) Is Connected to V–

Transistor Count, 00.

OP250 Die Size 0.044

× 0.045 Inch, 1,980 Sq. Mils

Substrate (Die Backside) Is Connected to V–

Transistor Count, 0.

OP450 Die Size 0.052

× 0.058 Inch, 3,016 Sq. Mils

Substrate (Die Backside) Is Connected to V–

Transistor Count, 127.

2.5

2.0

0

0

200

20

40

60

80

100

120

140

160

180

1.5

1.0

0.5

Figure 1.

±V

OBSOLETE