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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STA333W Fiches technique(PDF) 38 Page - STMicroelectronics |
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STA333W Fiches technique(HTML) 38 Page - STMicroelectronics |
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38 / 42 page  Package thermal characteristics STA333W 38/42 9 Package thermal characteristics A thermal resistance of 25° C/W can be achieved using a ground copper area of 3 x 3 cm, and using 16 vias, on the PCB (see Figure 15). The amount of power dissipated within the device depends primarily on the supply voltage, load impedance and output modulation level. The max estimated dissipated power for the STA333W is 3 W. This gives, with the suggested board copper area, a maximum ∆Tj of 75 °C. This gives a safety margin before the thermal protection intervention is invoked (Tj = 150 °C) in consumer environments where a 50 °C is the maximum ambient temperature. Figure 15. Thermal characteristics |
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