M27V322-100B1 datasheet(4/13 Pages) STMICROELECTRONICS

4 / 13 page

M27V322

4/13

Table 5. AC Measurement Conditions

High Speed

Standard

Input Rise and Fall Times

≤ 10ns

≤ 20ns

Input Pulse Voltages

0 to 3V

0.4V to 2.4V

Input and Output Timing Ref. Voltages

1.5V

0.8V and 2V

Figure 3. AC Testing Input Output Waveform

AI01822

High Speed

1.5V

2.4V

Standard

0.4V

2.0V

0.8V

Figure 4. AC Testing Load Circuit

AI01823B

1.3V

OUT

CL = 30pF for High Speed

CL = 100pF for Standard

CL includes JIG capacitance

3.3k

Ω

1N914

DEVICE

UNDER

TEST

Table 6. Capacitance (1) (TA = 25 °C, f = 1 MHz)

Note: 1. Sampled only, not 100% tested.

Symbol

Parameter

Test Condition

Min

Max

Unit

CIN

Input Capacitance

VIN = 0V

COUT

Output Capacitance

VOUT = 0V

put control and by properly selected decoupling

capacitors. It is recommended that a 0.1µF ceram-

ic capacitor is used on every device between VCC

and VSS. This should be a high frequency type of

low inherent inductance and should be placed as

close as possible to the device. In addition, a

4.7µF electrolytic capacitor should be used be-

tween VCC and VSS for every eight devices. This

capacitor should be mounted near the power sup-

ply connection point. The purpose of this capacitor

is to overcome the voltage drop caused by the in-

ductive effects of PCB traces.

System Considerations

The power switching characteristics of Advanced

CMOS EPROMs require careful decoupling of the

supplies to the devices. The supply current ICC

has three segments of importance to the system

designer: the standby current, the active current

and the transient peaks that are produced by the

falling and rising edges of E. The magnitude of the

transient current peaks is dependent on the ca-

pacitive and inductive loading of the device out-

puts. The associated transient voltage peaks can

be suppressed by complying with the two line out-

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