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STM32F101X6 Fiches technique(PDF) 63 Page - STMicroelectronics |
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STM32F101X6 Fiches technique(HTML) 63 Page - STMicroelectronics |
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63 / 74 page ![]() STM32F101xx Package characteristics 63/74 6 Package characteristics 6.1 Package mechanical data In order to meet environmental requirements, ST offers the STM32F101xx in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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