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STM32F427AI Fiches technique(PDF) 218 Page - STMicroelectronics |
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STM32F427AI Fiches technique(HTML) 218 Page - STMicroelectronics |
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218 / 240 page ![]() Package information STM32F427xx STM32F429xx 218/240 DS9405 Rev 12 Figure 90. UFBGA169 - Footprint example Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. Table 118. UFBGA169 - Example of PCB design rules (0.5 mm pitch BGA) Dimension Values Pitch 0.5 mm Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. BGA_WLCSP_FT_V1 Dsm Dpad |
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