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MPC7441 Fiches technique(PDF) 29 Page - Freescale Semiconductor, Inc

No de pièce MPC7441
Description  RISC Microprocessor Hardware Specifications
PDF  60 Pages
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC7441 Fiches technique(HTML) 29 Page - Freescale Semiconductor, Inc

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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
Freescale Semiconductor
29
Package Description
8
Package Description
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1
Package Parameters for the MPC7448, 360 HCTE BGA
The package parameters are as provided in the following list. The package type is 25
× 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Package outline
25
× 25 mm
Interconnects
360 (19
× 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.32 mm
Maximum module height
2.80 mm
Ball diameter
0.89 mm (35 mil)
Coefficient of thermal expansion12.3 ppm/°C



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