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L6285 Fiches technique(PDF) 13 Page - STMicroelectronics |
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L6285 Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 16 page ![]() THERMAL CHARACTERISTICS The cooling of the device is obtained by soldering its ground pins on a proper p.c.b copper side , acting as a true heatsink. By considering four squared side as in Fig.10, the junction to ambient thermal resistance has been measured (see Fig.11). The typical transient thermal resistance versus values of single pulse width of power is shown in Fig.12. In general these thermal charac- teristics are very important to the designer to opti- mize the L6285 applications. Figure 10: Four ”on board” Square Heatsink Figure 11: Typical Rth j-amb vs. lenght ”l” (Fig. 10) Figure 12: Typical Transient Thermal Resistance vs. Time or Pulse Width L6285 13/16 |
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