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STM32L433CB Fiches technique(PDF) 205 Page - STMicroelectronics |
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STM32L433CB Fiches technique(HTML) 205 Page - STMicroelectronics |
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205 / 227 page ![]() DS11449 Rev 7 205/227 STM32L433xx Package information 219 Figure 50. UFBGA64 – Recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 107. UFBGA64 – Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 108. UFBGA64 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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