NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PACKAGE OUTLINE

www.ti.com

4224376 / C 07/2021

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

RGE0024C

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

4.1

3.9

4.1

3.9

PIN 1 INDEX AREA

1 MAX

0.05

0.00

SEATING PLANE

C

2X 2.5

2.1±0.1

2X

2.5

20X 0.5

1

6

7

12

13

18

19

24

24X 0.30

0.18

24X 0.50

0.30

(0.2) TYP

PIN 1 ID

(OPTIONAL)

25