BAT54SWFILM datasheet(4/15 Pages) STMICROELECTRONICS

4 / 15 page

Characteristics

BAT54

4/15

DocID5505 Rev 12

Figure 7. Thermal resistance junction to

ambient versus copper surface under each lead

(SOD323)

Figure 8. Relative variation of thermal

impedance junction to ambient versus pulse

duration (SOD323)

200

300

400

500

600

th(j-a)(°C/W)

Epoxy FR4

CU=35 µm

SCU(mm²)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)/Rth(j-a)

Single pulse

SOD323

Epoxy FR4

CU=2.25 mm²

CU=35 µm

tP(s)

Figure 9. Relative variation of thermal

impedance junction to ambient versus pulse

duration (SOT23)

Figure 10. Relative variation of thermal

impedance junction to ambient versus pulse

duration (SOD-523)

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

th(j-a)/Rth(j-a)

Alumine substrate

10 x 8 x 0.5 mm

Single pulse

SOT23

tP(s)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

th(j-a)/Rth(j-a)

Single pulse

SOD523

Epoxy FR4

CU=35 µm

tP(s)

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