ADL8124ACPZN-R7 datasheet(6/29 Pages) AD

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Data Sheet

ADL8124

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 29

Table 8. Absolute Maximum Ratings

Parameter

Rating

VDD

7.5V

VENBL

VDD

RF Input Power Survivability (RFIN)

28dBm

Continuous Power Dissipation (PDISS)

TCASE = 85°C

0.9W

TCASE = 125°C

0.46W

Temperature

Storage Range

−65°C to +150°C

Operating Range

−55°C to +125°C

Maximum Channel

175°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the channel-to-case thermal resistance.

Table 9. Thermal Resistance1

Package Type

θJC

Unit

CP-8-30

TCASE = 25°C

86.1

°C/W

TCASE = 85°C

99.7

°C/W

TCASE = 125°C

108.5

°C/W

1 Thermal resistance varies with operating conditions.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADL8124

Table 10. ADL8124, 8-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±500

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.

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