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STPST80H100L2Y Fiches technique(PDF) 6 Page - STMicroelectronics |
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STPST80H100L2Y Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 10 page ![]() Table 5. HU3PAK package mechanical data Ref. Dimensions mm Min. Typ. Max. A 3.40 3.50 3.60 A1 0.05 b 0.50 0.60 0.70 b2 0.50 0.70 1.00 b3 0.80 0.90 1.00 c 0.40 0.50 0.60 c2 0.40 0.50 0.60 D 11.70 11.80 11.90 D1 8.80 8.955 9.10 E 13.90 14.00 14.10 E1 12.30 12.40 12.50 E2 7.75 7.80 7.85 e BSC 1.27 H 18.00 18.58 19.00 L 2.40 2.52 2.60 L1 3.05 L2 0.90 1.00 1.10 L3 BSC 0.26 L4 0.075 0.125 0.175 L5 1.83 1.93 2.03 L6 2.14 2.24 2.34 L7 4.44 4.54 4.64 aaa 0.10 F1 2.90 3.00 3.10 F2 2.40 2.50 2.60 F3 0.25 0.35 0.45 N1 3.80 3.90 4.00 N2 0.25 0.30 0.45 N3 0.80 0.90 1.00 T 0.50 0.67 0.70 T2 9.18 9.38 9.43 θ1 0° 8° θ2 0° 8° 1. Package outline exclusive of any mold flashes dimensions. 2. Package outline exclusive of burr dimensions. 3. Max resin gate protrusion: 0.25 mm. 4. The planarity of the package backside 50 micron max. 5. BSC: basic spacing between centers STPST80H100-Y Package information DS14555 - Rev 2 page 6/10 |
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