TLV313IDBVR.A datasheet(41/44 Pages) TI2

No de pièce	TLV313IDBVR.A

Description	TLVx313 Low-Power, Rail-to-Rail In/Out, 500-μV Typical Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems

PDF	44 Pages

Scroll/Zoom	100%

Fabricant	TI2 [Texas Instruments]

Site Internet	https://www.ti.com

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41 / 44 page

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PACKAGE OUTLINE

6X 0.65

1.95

0.38

0.25

5.05

4.75

TYP

SEATING

PLANE

0.15

0.05

0.25

GAGE PLANE

0 -8

1.1 MAX

0.23

0.13

3.1

2.9

NOTE 4

3.1

2.9

NOTE 3

0.7

0.4

VSSOP - 1.1 mm max height

DGK0008A

SMALL OUTLINE PACKAGE

4214862/A 04/2023

0.13

C A B

PIN 1 INDEX AREA

SEE DETAIL A

0.1 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-187.

PowerPAD is a trademark of Texas Instruments.

A 20

DETAIL A

TYPICAL

SCALE 4.000

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