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STPST3H100AF Fiches technique(PDF) 5 Page - STMicroelectronics |
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STPST3H100AF Fiches technique(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu= 70 µm) 0 30 60 90 120 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Rth(j-a)(°C/W) SOD128flat SCu(cm²) Epoxy printed board FR4, copper thickness: 70 μm Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu= 70 µm) 0 30 60 90 120 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Rth(j-a)(°C/W) SMB-Flat SCu(cm²) Epoxy printed board FR4, copper thickness: 70 μm STPST3H100 Characteristics (curves) DS13610 - Rev 4 page 5/12 |
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