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STPS30M60DJF Fiches technique(PDF) 5 Page - STMicroelectronics |
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STPS30M60DJF Fiches technique(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PowerFLAT 5x6 package information • Epoxy meets UL 94,V0 • Cooling method: by conduction (C) Figure 9. PowerFLAT 5x6 package outline (non-contractual) Bottom view Side view Top view Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. STPS30M60DJF Package information DS9019 - Rev 2 page 5/9 |
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