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STPS5L60U Fiches technique(PDF) 5 Page - STMicroelectronics

No de pièce STPS5L60U
Description  5 A - 60 V power Schottky rectifier
PDF  16 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPS5L60U Fiches technique(HTML) 5 Page - STMicroelectronics

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Figure 7. Reverse leakage current versus reverse voltage
applied (typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
0
5
10 15 20 25 30 35 40 45 50 55 60
360°
α
I
R(mA)
T
j = 150 °C
V
R(V)
T
j = 125 °C
T
j = 100 °C
T
j = 75 °C
T
j = 50 °C
T
j = 25 °C
Figure 8. Junction capacitance versus reverse voltage
applied (typical values)
10
100
1000
1
10
100
C(pF)
V
R
(V)
360°
α
F = 1 MHz
VOSC = 30 mVRMS
T
j
= 25 °C
Figure 9. Forward voltage drop versus forward current
(low level)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
360°
α
IF(A)
Tj = 125 °C
(maximum values)
V
F
(V)
Tj = 25 °C
(maximum values)
Tj = 125 °C
(typical values)
Figure 10. Forward voltage drop versus forward current
(high level)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
VF(V)
0
5
10
15
20
25
30
35
40
45
50
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IF(A)
Tj = 125 °C
(maximum values)
VF(V)
Tj = 125 °C
(typical values)
Tj = 25 °C
(maximum values)
Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
50
100
150
200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
(°C/W)
th(j-a)
SMB
S(Cu)(cm²)
Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead (SMB flat Notch)
0
50
100
150
200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Rth(j-a)(°C/W)
SMB Flat Notch
SCu(cm²)
Epoxy printed board FR4, copper thickness: 35 μm
STPS5L60
Characteristics (curves)
DS2741 - Rev 5
page 5/16



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