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BQ40Z50RSMT-R2.A Fiches technique(PDF) 52 Page - Texas Instruments |
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BQ40Z50RSMT-R2.A Fiches technique(HTML) 52 Page - Texas Instruments |
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52 / 55 page ![]() www.ti.com PACKAGE OUTLINE C 32X 0.25 0.15 1.4 0.05 32X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 28X 0.4 2X 2.8 2X 2.8 A 4.1 3.9 B 4.1 3.9 0.25 0.15 0.5 0.3 4X (0.45) VQFN - 1 mm max height RSM0032A PLASTIC QUAD FLATPACK - NO LEAD 4219107/A 11/2017 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 8 17 24 9 16 32 25 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 33 SCALE 3.000 DETAIL OPTIONAL TERMINAL TYPICAL |
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