STW4810CHDRLF datasheet(72/78 Pages) STMICROELECTRONICS

No de pièce	STW4810CHDRLF

Description	Power management for multimedia processors

PDF	78 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

Logo

72 / 78 page

Package mechanical data

STw4810

72/78

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

7.1

TFBGA 84 balls

See

Figure 16: TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch drawing.

Table 55.

TFBGA 84 balls 6x6x1.2mm body size / 0.5 ball pitch dimensions(1)

These measurements conform to JEDEC standards

Drawing dimensions (mm)

Min.

Typ.

Max.

1.16

0.20

0.25

0.30

0.82

0.250.300.35

5.906.006.10

4.50

5.906.006.10

4.50

0.450.500.55

0.650.750.85

ddd

0.08

STW4810CHDRLF Fiches technique(PDF) 72 Page - STMicroelectronics