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STPS3150U Fiches technique(PDF) 8 Page - STMicroelectronics |
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STPS3150U Fiches technique(HTML) 8 Page - STMicroelectronics |
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8 / 10 page ![]() Package information STPS3150 8/10 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. DO-201AD Package dimensions REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 9.50 0.374 B 25.40 1.000 C 5.30 0.209 D(1) 1. The lead diameter D is not controlled over zone E 1.30 0.051 E 1.25 0.049 Note 2(2) 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) 15 0.59 ØC ØD A EE Note 2 Note 1 Note 1 BB |
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