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LP3921 Fiches technique(PDF) 41 Page - Texas Instruments |
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LP3921 Fiches technique(HTML) 41 Page - Texas Instruments |
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41 / 44 page ![]() www.ti.com PACKAGE OUTLINE C 5.15 4.85 5.15 4.85 0.8 0.7 0.05 0.00 2X 3.5 28X 0.5 2X 3.5 32X 0.5 0.3 32X 0.30 0.18 3.1 0.1 (0.1) TYP WQFN - 0.8 mm max height RTV0032A PLASTIC QUAD FLATPACK - NO LEAD 4224386/B 04/2019 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 8 9 16 17 24 25 32 33 SCALE 2.500 A B |
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