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ST7580 Fiches technique(PDF) 30 Page - STMicroelectronics |
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ST7580 Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 33 page ![]() Package information ST7580 30/33 DocID022644 Rev 2 11 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. The ST7580 is hosted in a 48-pin thermally enhanced, very thin, fine pitch quad flat package no lead (VFQFPN) with exposed pad, which allows the device to dissipate the heat that is generated by the operation of the two linear regulators and the power amplifier. 11.1 VFQFPN48 (7 x 7 x 1.0 mm) package information Figure 15. VFQFPN48 (7 x 7 x 1.0 mm) package outline |
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