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ST10F271Z1 Fiches technique(PDF) 181 Page - STMicroelectronics |
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ST10F271Z1 Fiches technique(HTML) 181 Page - STMicroelectronics |
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181 / 185 page ![]() ST10F271Z1 Package information 181/185 26 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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