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CSD25501F3 Fiches technique(PDF) 9 Page - Texas Instruments |
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CSD25501F3 Fiches technique(HTML) 9 Page - Texas Instruments |
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9 / 12 page ![]() www.ti.com PACKAGE OUTLINE C 0.35 2X 0.16 0.14 2X 0.26 0.24 0.22 MAX 0.225 0.16 0.14 0.51 0.49 0.175 0.4 A 0.73 0.65 B 0.64 0.56 4223685/A 05/2017 PicoStar - 0.22 mm max height YJN0003A PicoStar PIN 1 INDEX AREA SEATING PLANE 1 2 0.015 C B A 0.015 C A B 3 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M 2. This drawing is subject to change without notice. 3. This package is a Pb-free bump design. Bump finish may vary. To determine the exact finish, refer to the device datasheet or contact a local TI representative. PicoStar is a trademark of Texas Instruments. TM TM SCALE 15.000 D: Max = E: Max = 0.72 mm, Min = 0.625 mm, Min = 0.66 mm 0.565 mm |
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