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AM486DE2 Fiches technique(PDF) 49 Page - Advanced Micro Devices |
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AM486DE2 Fiches technique(HTML) 49 Page - Advanced Micro Devices |
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49 / 52 page ![]() Am486DE2 Microprocessor 49 *0.350 ″ high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing). Table 15. Thermal Resistance (°C/W) θ JC and θJA for the Am486DE2 in 168-Pin PGA Package Cooling Mechanism θ JC θ JA vs. Airflow-ft/min. (m/sec) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.07) No Heat Sink 1.5 16.5 14.0 12.0 10.5 9.5 9.0 Heat Sink* 2.0 12.0 7.0 5.0 4.0 3.5 3.25 Heat Sink* and fan 2.0 5.0 4.6 4.2 3.8 3.5 3.25 Table 16. Maximum TA at Various Airflows in °C T A by Cooling Type Clock Airflow-ft/min. (m/sec) 0 (0) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.07) TA without Heat Sink 66 MHz 49.0 55.0 59.8 63.4 65.8 67.0 TA with Heat Sink 66 MHz 61.0 73.0 77.8 80.2 81.4 82.0 TAwith Heat Sink and fan 66 MHz 77.8 78.8 79.7 80.7 81.4 82.0 Figure 26. . Heat Sink Dimensions 0.290 ″ 0.100 ″ 0.040 ″ 1.53 ″ 0.350 ″ 0.060 ″ 0.115 ″ 17852B-113 |
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