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CSD23280F3T Fiches technique(PDF) 8 Page - Texas Instruments |
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CSD23280F3T Fiches technique(HTML) 8 Page - Texas Instruments |
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8 / 13 page ![]() 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 7.1 Mechanical Dimensions C 0.35 2X 0.16 0.14 2X 0.26 0.24 0.36 MAX 0.225 0.16 0.14 0.51 0.49 0.175 0.4 A 0.73 0.65 B 0.64 0.56 PIN 1 INDEX AREA SEATING PLANE 1 2 0.015 C B A 0.015 C A B 3 A. All linear dimensions are in millimeters (dimensions and tolerancing per AME T14.5M-1994). B. This drawing is subject to change without notice. C. This package is a lead-free solder land design. Table 7-1. Pin Configuration POSITION DESIGNATION Pin 1 Gate Pin 2 Source Pin 3 Drain CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 www.ti.com 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated |
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