TLE2426, TLE2426Y

THE RAIL SPLITTER"

PRECISION VIRTUAL GROUND

SLOS098D − AUGUST 1991 − REVISED MAY 1998

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

description (continued)

The C-suffix devices are characterized for operation from 0

°C to 70°C. The I suffix devices are characterized

for operation from −40

°C to 85°C. The M suffix devices are characterized over the full military temperature range

of −55

°C to 125°C.

OUT

IN

COMMON

1

2

3

4

8

7

6

5

OUT

COMMON

IN

NC

NOISE REDUCTION

NC

NC

NC

D, JG, OR P PACKAGE

(TOP VIEW)

NC − No internal connection

LP PACKAGE

(TOP VIEW)

TLE2426Y chip information

This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS:

15 MILS TYPICAL

BONDING PADS:

4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN

MILS.

60

88

OUT

(1)

(2)

(8)

(3)

NOISE

REDUCTION

IN

COMMON

+1

NOTE A:

Both bonding pads numbered 1, both numbered 2,

and both numbered 3, must be bonded out to the

corresponding functions pin.

(3) (3)

(2)

(2)

(1)

(1)

(8)