www.ti.com

PACKAGE OUTLINE

C

TYP

6.6

6.2

14X 0.65

16X

0.30

0.19

2X

4.55

(0.15) TYP

0 - 8

0.15

0.05

3.3

2.7

3.3

2.7

2X 1.34 MAX

NOTE 5

1.2 MAX

(1)

0.25

GAGE PLANE

0.75

0.50

A

NOTE 3

5.1

4.9

B

4.5

4.3

4X 0.166 MAX

NOTE 5

4214868/A 02/2017

PowerPAD

HTSSOP - 1.2 mm max height

PWP0016A

PLASTIC SMALL OUTLINE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. Features may not be present.

PowerPAD is a trademark of Texas Instruments.

TM

1

16

0.1

C A B

9

8

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.400

THERMAL

PAD

17