0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

PADS 1 & 2 (OPTIONAL FOR OTHERS)

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

PREFERRED FOR PADS 3-9

(1.8)

6X (0.65)

(3.05)

2X (0.34)

2X (0.65)

(2.7)

(R0.05) TYP

(

0.2) VIA

TYP

(0.22)

4X (0.2)

2X (1.18)

6X (0.65)

6X (0.34)

4X (0.5)

2X (1.1)

2X (0.65)

PKG

1

4

5

8

PKG

9

3

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

21

CSD86336Q3D

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SLPS666 – MARCH 2018

Product Folder Links: CSD86336Q3D

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Copyright © 2018, Texas Instruments Incorporated

9.3 Land Pattern Recommendation

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON

PCB Attachment (SLUA271).

3. Vias are optional depending on application, refer to device data sheet. If some or all are implemented,

recommended via locations are shown.