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TUSB9260PVP Fiches technique(PDF) 21 Page - Texas Instruments |
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TUSB9260PVP Fiches technique(HTML) 21 Page - Texas Instruments |
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21 / 24 page ![]() www.ti.com PACKAGE OUTLINE C 64X 0.19 0.13 0.07 C A B 60X 0.4 PIN 1 ID (0.13) TYP 0.15 0.05 0 -7 4X 6 9.2 8.8 TYP 3.581 3.321 3.581 3.321 B 7.2 6.8 NOTE 3 A 7.2 6.8 NOTE 3 0.75 0.45 0.25 GAGE PLANE 1.2 MAX (1) (0.15) TYP NOTE 5 (0.2) TYP NOTE 5 PLASTIC QUAD FLATPACK PowerPAD HTQFP - 1.2 mm max height PVP0064A PLASTIC QUAD FLATPACK 4218968/A 12/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MS-026. 5. Feature may not be present. TM PowerPAD is a trademark of Texas Instruments. 1 16 17 32 33 48 49 64 0.07 C A B SEE DETAIL A SEATING PLANE 0.08 C A 16 DETAIL A TYPICAL SCALE 1.900 1 16 17 32 33 48 49 64 65 |
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