150

TMP709

VCC

GND

HYST

SET

OT

Microprocessor

VCC

GND

RSET

470 k

2.7 V to 5.5 V

0.1 …F

Copyright © 2016, Texas Instruments Incorporated

9

TMP709

www.ti.com

SBOS583B – DECEMBER 2011 – REVISED DECEMBER 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

8 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP709 device is simple to configure. The only external components that the device requires are a bypass

capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF capacitor placed

as close as possible to the VCC supply pin. To minimize the internal power dissipation of the TMP709 family of

devices, use a pullup resistor value greater than 10 kΩ from the OT pin to the VCC pin. See the Hysteresis Input

section for hysteresis configuration, and the Set-Point Resistor (RSET) section for configuring the temperature

threshold.

8.2 Typical Application

Figure 5. Overtemperature Protection for a 60°C Trip Point

8.2.1 Design Requirements

For this design example, a 2.7-V to 5.5-V power supply, 60°C trip point, and 10°C hysteresis are used.