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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STM32F412RGY7PTR Fiches technique(PDF) 188 Page - STMicroelectronics |
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STM32F412RGY7PTR Fiches technique(HTML) 188 Page - STMicroelectronics |
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188 / 201 page  Package information STM32F412xE/G 188/201 DocID028087 Rev 7 Figure 79. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non solder mask defined (NSMD) pads are recommended. 4 to 6 mils solder paste screen printing process. Stencil opening is 0.400 mm. Stencil thickness is between 0.100 mm and 0.125 mm. Pad trace width is 0.120 mm. F 0.550 0.600 0.650 0.0217 0.0236 0.0256 ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 108. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Table 107. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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