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STR910FAM32X6 Fiches technique(PDF) 94 Page - STMicroelectronics |
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STR910FAM32X6 Fiches technique(HTML) 94 Page - STMicroelectronics |
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94 / 99 page ![]() Package mechanical data STR91xFAx32 STR91xFAx42 STR91xFAx44 94/99 9.1 Soldering information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label (JEDEC 020C). ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com. |
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