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MIC5166 Fiches technique(PDF) 6 Page - Microchip Technology |
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MIC5166 Fiches technique(HTML) 6 Page - Microchip Technology |
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6 / 36 page ![]() MIC5166 DS20006085B-page 6 2018 - 2019 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C — Maximum Junction Temperature TJ(MAX) — — +150 °C — Lead Temperature — — — +260 °C Soldering, 10 sec. Storage Temperature Range TS –65 — +150 °C — Package Thermal Resistances Thermal Resistance, 3x3 DFN 10-Ld JC —28.7 — °C/W — Thermal Resistance, 3x3 DFN 10-Ld JA —60.7 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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