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PCF8563T/F4 Fiches technique(PDF) 33 Page - NXP Semiconductors |
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PCF8563T/F4 Fiches technique(HTML) 33 Page - NXP Semiconductors |
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33 / 45 page ![]() PCF8563 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 11 — 26 October 2015 33 of 45 NXP Semiconductors PCF8563 Real-time clock/calendar 15. Package outline Fig 29. Package outline SOT650-1 (HVSON10) of PCF8563BS 0.5 0.2 1 0.05 0.00 A1 Eh b UNIT D(1) y e 2 e1 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 cDh 1.75 1.45 y1 3.1 2.9 2.55 2.15 0.30 0.18 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT650-1 MO-229 - - - - - - E(1) 0.55 0.30 L 0.1 v 0.05 w 0 2 mm 1 scale SOT650-1 HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm A(1) max. A A1 c detail X y Dh Eh e L 10 5 1 6 D E y1 C C B A 01-01-22 02-02-08 terminal 1 index area terminal 1 index area X e1 b A C C B v M w M Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. |
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