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PCF8563BS/4 Fiches technique(PDF) 5 Page - NXP Semiconductors |
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PCF8563BS/4 Fiches technique(HTML) 5 Page - NXP Semiconductors |
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5 / 45 page ![]() PCF8563 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 11 — 26 October 2015 5 of 45 NXP Semiconductors PCF8563 Real-time clock/calendar 7.2 Pin description [1] The die paddle (exposed pad) is connected to VSS through high ohmic (non-conductive) silicon attach and should be electrically isolated. It is good engineering practice to solder the exposed pad to an electrically isolated PCB copper pad for better heat transfer but it is not required as the RTC doesn’t consume much power. In no case should traces be run under the package exposed pad. Table 3. Pin description Symbol Pin Description SO8, TSSOP8 HVSON10 OSCI 1 1 oscillator input OSCO 2 2 oscillator output INT 3 4 interrupt output (open-drain; active LOW) VSS 45[1] ground SDA 5 6 serial data input and output SCL 6 7 serial clock input CLKOUT 7 8 clock output, open-drain VDD 8 9 supply voltage n.c. - 3, 10 not connected; do not connect and do not use as feed through |
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