www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(6.15)

(5.55)

(4.58)

2X (1)

2X (2.75)

(4.2)

(2.5)

(R0.05) TYP

TO-252 - 2.52 mm max height

KVU0003A

TO-252

4218915/A 02/2017

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

PKG

SYMM

3

1

4

NOTES: (continued)

5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers

SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

6. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL

EXPOSED

METAL

SOLDER MASK DETAILS

NOT TO SCALE

NON SOLDER MASK

DEFINED

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

DEFINED