POWER TYPE

0.8max.

0.5max

2.5max.

2max.

6±0.5

d

1

A

L

H1

1.6t

P

H2

d

W

.

2

P

2max

d

H

■Secondary Processed Products（mm）

 L Forming

 M Forming

φd

 UCL Forming

168

MOS FixedMetalOxideFilmResistors(Smalltype)

MOSX FixedMetalFilmResistors(Smalltype)

Type

MOS

MOSX

P±1

H

1±1

H

2±1

d

（Nominal）

L max.

Substrate

hole dia

1/2CL10A

10.0

5.3

4.0

0.6

φ0.8

1CL12.5A

12.5

7.0

0.8

φ1.0

1CL15A

15.0

6.5

2CL15A

7.0

17.5

2CL15F

4.5

2CL20A

20.0

9.0

2CL20D

4.8

3CL20A

8.0

3CL20C

10.0

3CL20T

4.0

3CL25A

25.0

7.0

3CL30A

30.0

7.0

5CL30A

8.5

5CL35A

35.0

5.5

Type

MOS

MOSX

P±1

H±1

d

（Nominal）

Substrate

hole dia

1/2CM10C

10.0

3.5

0.6

φ0.8

1/2CM10F

10.0

5.0

0.6

1CM12.5C

12.5

3.5

0.8

φ1.0

1CM12.5D

12.5

4.0

0.8

1CM15F

15.0

5.0

0.8

1CM15J

15.0

6.3

0.8

1CM15S

15.0

11.0

0.8

2CM15C

15.0

3.5

0.8

2CM15E

15.0

4.5

0.8

2CM20D

20.0

4.0

0.8

2CM20U

20.0

13.5

0.8

3CM20E

20.0

4.6

0.8

3CM26E

26.0

4.7

0.8

5CM30U

30.0

13.0

0.8

Type

MOS

MOSX

H1±1

H2±1

H3±1

d

（Nominal） Insertion pitch

Substrate

hole dia

1CUCL

13.0

17.0max.

3.5

0.8

5.0

φ1.0

2CUCL

14.5

18.5max.

3.5

3CUCL

20.0max.

22.0

4.0

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

Oct. 2020

Contact our sales representatives before you use our products for applications including automotives, medical equipment and aerospace equipment.

Malfunction or failure of the products in such applications may cause loss of human life or serious damage.

www.koaglobal.com

■Secondary Processed Products（mm）

VTF Radial Taping

φD

P

Insulated Lead

H0

HA

P1

F

F1

φD0

P0

W1

W

Insulated Lead

φD

P

H0

H

A

P1

F

φD0

P0

W1

W

P

T

A

d

B

D

A

Solder pad

Component

169

Various lead forming shapes are available upon request. Please feel free to ask us.

VTP Radial Taping

N Forming

Recommended Pad Dimensions

Breed

MOS/MOSX

Rating

1/2C

1C

2C

2C

Type

VTP

VTP

VTP

VTF

A

6.2±0.5

9.0±10

12.0±1.0

12.0±1.0

φD

2.5±0.5

3.0±0.5

4.0±0.5

4.0±0.5

d（nominal）

0.6

0.65

0.8

F

5.0±0.5

F

1

7.3max.

H

13max.

16max.

22.5max.

22.5max.

H

0

16＋1.0/－0

P

12.7±1.0

P

0

12.7±0.3

P

1

3.85±0.7

W

18.0±0.5

W

1

9.0±0.5

φD

0

4.0±0.2

Substrate

hole dia

φ0.8

φ1.0

・The color of insulated lead： Green

・Insertion pitch：5.0mm

Breed

MOS/MOSX

Rating

1C

2C

3C

Type

N14.5TEB

N17TEB

N20TEG

P±1

14.5

17.0

20.0

T±0.5

5.0

6.0

7.5±1.0

A±0.5

4.8

5.8

6.5

d（nominal）

0.8

0.8

0.8

・Need a dedicated nozzle for automatic mounting.

・Please inquire to us before use.

Breed

MOS/MOSX

Rating

1C

2C

3C

Type

N14.5TEB

N17TEB

N20TEG

A

12.5

14.6

17.6

B

16.5

19.4

22.4

C

7.0

8.0

9.5

D

2.0

2.4

2.4

・Please refer to APPENDIX for the packaging specification.

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

Oct. 2020

Contact our sales representatives before you use our products for applications including automotives, medical equipment and aerospace equipment.

Malfunction or failure of the products in such applications may cause loss of human life or serious damage.

www.koaglobal.com

Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

Contact our sales representatives before you use our products for applications including automotives, medical equipment and aerospace equipment.

Malfunction or failure of the products in such applications may cause loss of human life or serious damage.

www.koaglobal.com

Oct. 2022